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Description

One of several Physical Vapor Deposition (PVD) tools, similar in operation to Enerjet Evaporator. Used for depositing insulators and optical materials (thickness.5um+) Designed for depositing when liftoff is intended.

Specifications

  • Used for metal and dielectric PVD.
  • Fixturing Lift-off dome standard. One custom for high yield dielectric PVD.
  • Substrate size:Fragments up to 4 inch.
  • Maximum capacity: 6,4" wafers. plus 8,3" wafers.

Materials


Applications


Tool Documents

© 2011 Lurie Nanofabrication Facility, University of Michigan
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