Equipment

Chemical Vapor Deposition (CVD)¶

LPCVD¶

• S1 T2 - LTO 100mm only (No Metals)
• S1 T3 - N-Type in Situ Doped Poly-Si 150mm only
• S1 T4 - LTO 150mm only (No Metals)
• S2 T2 - Nitride-HTO 150mm only
• S2 T3 - Nitride-HTO-Oxynitride 100mm only
• S2 T4 - Low Stress Nitride 100mm only
• S3 T3 - Flat Poly-Si 100mm only
• S3 T4 - N-Type in Situ Doped Poly-Si 100mm only
• S4 T2 - PSG 100mm only
• S4 T3 - P-Type in Situ Doped Poly-Si 150mm only
• S4 T4 - TEOS 100mm only
• S6 T2 - Nitride-HTO-OxyNitride
• S6 T3 - CVD Poly-Si
• S6 T4 - LTO (some metals allowed)
  

PECVD¶

• GSI PECVD
  

ALD¶

• Oxford ALD
  

Parylene¶

• PDS 2035
  

Dry Etching¶

Plasma Ashing¶

• March Asher
• YES Plasma Stripper
  

RIE¶

• LAM 9400
• Oxford ICP RIE
• Plasmatherm 790
  

DRIE¶

• STS Glass Etcher
• STS Pegasus 4
• STS Pegasus 6
  

Other¶

• Xactix XeF2
  

Metrology¶

• AutoEL Ellipsometer
• Dektak 6 M Surface Profilometer
• Flexus 2320-S
• Height Gauge
• Miller FPP-5000 4-Point Probe
• NanoMan AFM
• NanoSpec 6100
• Olympus BX-51 Fluorescence Microscope (Wet Chemistry)
• Olympus LEXT Interferometer (Wet Chemistry)
• Dektak 6 M Surface Profilometer (Wet Chemistry)
• SEM In-line
• Woollam M-2000DI Ellipsometer
• Zygo NewView 5000
  

Testing¶

• Alessi probe station
• HP4145 Parametric Analyzer
• Keithley 4200-1
• Keithley 4200-2
  

Packaging¶

• ADT 7100 Dicing Saw
• Scriber
• Wire Bonder
  

Patterning¶

Lithography¶

• ACS 200 cluster tool
• CEE Spinner
• CEE Developer 1
• CEE Developer 2
• EVG620 Bond Aligner
• Headway Spinner
• Heidelberg uPG 501
• GCA AS200 AutoStep
• MA/BA-6 Mask/Bond Aligner
• MA6 Mask Aligner
• Mask Maker
• MJB3-1
• MJB3-2
• Raith-150 E-beam
• Solitec Spinner
• YES Image Reversal Oven
  

Wet Chemistry¶

• Dimatix InkJet
• MJB 45S
• NanoInk DPN 5000
  

Physical Vapor Deposition (PVD)¶

Evaporation¶

• Cooke Evaporator
• EnerJet Evaporator
• SJ-20 Evaporator
• SJ-26 Evaporator
  

Sputtering¶

• Denton Explorer-14
• EnerJet Sputter Coater
• Lab18_01
• Lab18_02
• Tegal ALN Sputter
  

Plating¶

• Gold Plating Station
• Nickel Plating (Wet Chemistry)
• Copper Plating (Wet Chemistry)
• Indium Plating (Wet Chemistry)
• Permalloy Plating (Wet Chemistry)
  

Polishing¶

• CMP IPEC-472
• Lapper
  

Thermal Processing¶

Annealing¶

• JetFirst-100 Forming
• JetFirst-150 RTP
• A1, Sintering
• S1 T1 - Annealing 100mm and 150mm
• S5 T2 - Phosphorous Anneal-Oxidation 100mm only
• S5 T4 - Boron Anneal-Oxidation 100mm only
• S6 T1 - Anneal III- V Material
• Wet Chemistry Convection Oven
  

Diffusion/Doping¶

• S5 T1 - Phosphorous Diffusion 100mm only
• S5 T3 - Boron Diffusion 100mm only
• A2, Boron-dope
  

Oxidation¶

• S3 T1 - Dry Oxidation 100mm and 150mm
• S3 T2 - Wet Oxidation 100mm and 150mm
• S5 T2 - Phosphorous Anneal-Oxidation 100mm only
• S5 T4 - Boron Anneal-Oxidation 100mm only
  

Wafer Bonding¶

• EVG501s Bonder (DELETE THIS ONE ?)
• EVG620 Bond Aligner
• CL200 Megasonic Cleaner
• nP12 nanoPREP
• EVG 510 Bonder
• EVG 520i Bonder
• SUSS SB-6E Bonder
  

Wet Processing¶

Wet Benches/Fume hoods¶

• Cleanroom
  • 1480A
    • Spinner Bench 21
    • Solvent Bench 22
    • Base Bench 23
  • 1480B
    • Acid Bench 12
    • Solvent Bench 14
    • Mask 13
  • 1480C
    • Acid Bench 02
    • Solvent Bench 03
  • 1440C
    • Solvent Bench 1440C
    • Acid Bench 1440C
    • Base Bench 1440C
    • Electroplating Fume Hood 1440C
  • 1440B
    • Acid Bench 1440B
    • Base Bench 1440B
  • 1440A
    • Solvent Bench 1440A
    • Mask Clean Bench 1440A
    • Pre-Furnace Clean Bench 1440A
    • Acid Bench 1440A
    • Base Bench 1440A
• Wet Chemistry
  • Acid Bench
  • Base Bench
  • EDP Bench
  • Solvent Bench
    

Drying¶

• Single Stack Spin Rinse Dryer
• Double Stack Spin Rinse Dryer
  

Sonication¶

• Sonicator 1440C
  

Wet Clean¶

• SSEC Wafer Cleaner Wet Chemistry (Wet Chemistry)