Hot Plate

Description¶

a heating element, occasionally used as a heat resistant surface. Several are located in chemical benches, and others are just out on tables. Located in wet benches of rooms 1440A,1440B, 1440C, 1480B of the clean room of the Lurie Nanofabrication Facility.

Processes¶

• used to mount wafers using Crystal Bond. The heat from the plate melts the wax.
• used in PRS 2000, Positive Resist Stripper process to heat the PRS-2000 (cmos).
• used in Piranha Clean process as a heat resistant surface.
• used in Aluminum Etch Type A process
• used in NI Etch process
• used in PZT Wet Etching to heat up HCL
• used in Ti-etch for active ion-exchangeable glass to heat up water.
• Wet Etch Using TMAH
• Creating Negative Photoresist On InP Substrate
• SU-8 Negative Resist and Developer Process
• PDMS Process
• Bonding glass and Silicon using PMMA