Equipment

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The following is a list of equipment available in the Clean Room and Wet Chemistry Room of the Lurie Nanofabrication Facility (LNF). Equipment is typically reserved through the online booking system via LNF Online Data Services. Users must be trained and authorized on equipment before use.

Table of Contents [Hide/Show] Chemical Vapor Deposition (CVD)    LPCVD    PECVD    ALD    Parylene Dry Etching    Plasma Ashing    RIE    DRIE    Other Metrology    Testing Packaging Patterning    Lithography    Wet Chemistry Physical Vapor Deposition (PVD)    Evaporation    Sputtering Plating Polishing Thermal Processing    Annealing    Diffusion/Doping    Oxidation Wafer Bonding Wet Processing    Wet Benches/Fume hoods    Drying    Sonication    Wet Clean

Chemical Vapor Deposition (CVD)¶

LPCVD¶

Sx Ty refers to tube y in Tempress furnace stack x. Stacks 1-5 are located in 1480C; stack 6 is located in 1440B.

• S1 T2 - LTO 100mm only (No Metals)
• S1 T3 - N-Type in Situ Doped Poly-Si 150mm only
• S1 T4 - LTO 150mm only (No Metals)
• S2 T2 - Nitride-HTO 150mm only
• S2 T3 - Nitride-HTO-Oxynitride 100mm only
• S2 T4 - Low Stress Nitride 100mm only
• S3 T3 - Flat Poly-Si 100mm only
• S3 T4 - N-Type in Situ Doped Poly-Si 100mm only
• S4 T2 - PSG 100mm only
• S4 T3 - P-Type in Situ Doped Poly-Si 150mm only
• S4 T4 - TEOS 100mm only
• S6 T2 - Nitride-HTO-OxyNitride
• S6 T3 - CVD Poly-Si
• S6 T4 - LTO (some metals allowed)
  

PECVD¶

• GSI PECVD
  

ALD¶

• Oxford ALD
  

Parylene¶

• PDS 2035
  

Dry Etching¶

Plasma Ashing¶

• March Asher
• YES Plasma Stripper
  

RIE¶

• LAM 9400
• Oxford ICP RIE
• Plasmatherm 790
  

DRIE¶

• STS Glass Etcher
• STS Pegasus 4
• STS Pegasus 6
  

Other¶

• Xactix XeF2
  

Metrology¶

• AutoEL Ellipsometer
• Dektak 6 M Surface Profilometer
• Flexus 2320-S
• Height Gauge
• Miller FPP-5000 4-Point Probe
• NanoMan AFM
• NanoSpec 6100
• Olympus BX-51 Fluorescence Microscope (Wet Chemistry)
• Olympus LEXT Interferometer (Wet Chemistry)
• Dektak 6 M Surface Profilometer (Wet Chemistry)
• SEM In-line
• Woollam M-2000DI Ellipsometer
• Zygo NewView 5000
  

Testing¶

• Alessi probe station
• HP4145 Parametric Analyzer
• Keithley 4200-1
• Keithley 4200-2
  

Packaging¶

• ADT 7100 Dicing Saw
• Scriber
• Wire Bonder
  

Patterning¶

Lithography¶

• ACS 200 cluster tool
• CEE Spinner
• CEE Developer 1
• CEE Developer 2
• EVG620 Bond Aligner
• Headway Spinner
• Heidelberg uPG 501
• GCA AS200 AutoStep
• MA/BA-6 Mask/Bond Aligner
• MA6 Mask Aligner
• Mask Maker
• MJB3-1
• MJB3-2
• Raith-150 E-beam
• Solitec Spinner
• YES Image Reversal Oven
  

Wet Chemistry¶

• Dimatix InkJet
• MJB 45S
• NanoInk DPN 5000
  

Physical Vapor Deposition (PVD)¶

Evaporation¶

• Cooke Evaporator
• EnerJet Evaporator
• SJ-20 Evaporator
• SJ-26 Evaporator
  

Sputtering¶

• Denton Explorer-14
• EnerJet Sputter Coater
• Lab18_01
• Lab18_02
• Tegal ALN Sputter
  

Plating¶

• Gold Plating Station
• Nickel Plating (Wet Chemistry)
• Copper Plating (Wet Chemistry)
• Indium Plating (Wet Chemistry)
• Permalloy Plating (Wet Chemistry)
  

Polishing¶

• CMP IPEC-472
• Lapper
  

Thermal Processing¶

Annealing¶

• JetFirst-100 Forming
• JetFirst-150 RTP
• A1, Sintering
• S1 T1 - Annealing 100mm and 150mm
• S5 T2 - Phosphorous Anneal-Oxidation 100mm only
• S5 T4 - Boron Anneal-Oxidation 100mm only
• S6 T1 - Anneal III- V Material
• Wet Chemistry Convection Oven
  

Diffusion/Doping¶

• S5 T1 - Phosphorous Diffusion 100mm only
• S5 T3 - Boron Diffusion 100mm only
• A2, Boron-dope
  

Oxidation¶

• S3 T1 - Dry Oxidation 100mm and 150mm
• S3 T2 - Wet Oxidation 100mm and 150mm
• S5 T2 - Phosphorous Anneal-Oxidation 100mm only
• S5 T4 - Boron Anneal-Oxidation 100mm only
  

Wafer Bonding¶

• EVG501s Bonder (DELETE THIS ONE ?)
• EVG620 Bond Aligner
• CL200 Megasonic Cleaner
• nP12 nanoPREP
• EVG 510 Bonder
• EVG 520i Bonder
• SUSS SB-6E Bonder
  

Wet Processing¶

Wet Benches/Fume hoods¶

• Cleanroom
  • 1480A
    • Spinner Bench 21
    • Solvent Bench 22
    • Base Bench 23
  • 1480B
    • Acid Bench 12
    • Solvent Bench 14
    • Mask 13
  • 1480C
    • Acid Bench 02
    • Solvent Bench 03
  • 1440C
    • Solvent Bench 1440C
    • Acid Bench 1440C
    • Base Bench 1440C
    • Electroplating Fume Hood 1440C
  • 1440B
    • Acid Bench 1440B
    • Base Bench 1440B
  • 1440A
    • Solvent Bench 1440A
    • Mask Clean Bench 1440A
    • Pre-Furnace Clean Bench 1440A
    • Acid Bench 1440A
    • Base Bench 1440A
• Wet Chemistry
  • Acid Bench
  • Base Bench
  • EDP Bench
  • Solvent Bench
    

Drying¶

• Single Stack Spin Rinse Dryer
• Double Stack Spin Rinse Dryer
  

Sonication¶

• Sonicator 1440C
  

Wet Clean¶

• SSEC Wafer Cleaner Wet Chemistry (Wet Chemistry)