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1440C
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Modified on 11/27/2012 03:55 PM
by
Zylema, Jacob
Categorized as
Facilities
Acid Bench 1440C
Chlorobenzene Soak
Chromerge Cleaning Solution
Citric Acid Selective Etch
Copper Phthalocyanine (CuPc) etching
Electroplating Fume Hood 1440C
Gold Etchant TFAC SOP
HCl-based Aluminum Etchant Mixture
Headway Spinner
Hot Plate
JT Baker Tergitol Clean
KOH etch (mainly for SiGe process)
Lurie Nanofabrication Facility
PRS 2000, Positive Resist Stripper
SBW: Saturated Bromine Water Etch Process
Solvent Bench 1440C
Sonicator 1440C
Ti-etch for active ion-exchangeable glass
Acid Bench 1440C
Chlorobenzene Soak
Chromerge Cleaning Solution
Citric Acid Selective Etch
Copper Phthalocyanine (CuPc) etching
Electroplating Fume Hood 1440C
Gold Etchant TFAC SOP
HCl-based Aluminum Etchant Mixture
Headway Spinner
Hot Plate
JT Baker Tergitol Clean
KOH etch (mainly for SiGe process)
Lurie Nanofabrication Facility
PRS 2000, Positive Resist Stripper
SBW: Saturated Bromine Water Etch Process
Solvent Bench 1440C
Sonicator 1440C
Ti-etch for active ion-exchangeable glass
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Description
¶
The following is the processes and equipment used in this room, colloquially referred to as the GaAs bay.
Equipment
¶
Headway Spinner
Acid Bench 1440C
Solvent Bench 1440C
Sonicator 1440C
Electroplating Fume Hood 1440C
Hot Plates
Processes
¶
Acid Bench
¶
Chromerge Cleaning Solution
Citric Acid Selective Etch
Copper Phthalocyanine (CuPc) etching
Gold Etchant TFAC SOP
HCl-based Aluminum Etchant Mixture
SBW: Saturated Bromine Water Etch Process
Ti-etch for active ion-exchangeable glass
Solvent Bench
¶
Chlorobenzene Soak
PRS 2000, Positive Resist Stripper
JT Baker Tergitol Clean
Base Bench
¶
KOH etch (mainly for SiGe process)
© 2011 Lurie Nanofabrication Facility, University of Michigan