Editing

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Description¶

This page gives information on how to edit this wiki. Currently, only staff members can edit pages, but any user can contribute to a page discussion, which we will use to get feedback on pages.

How to Edit This Wiki¶

These pages describe how to edit the wiki.

• Basic editing
• Basic WikiMarkup
• Making new pages
• How to apply a template
• How to categorize a page
• How to make links to other pages
• How to add pictures
• Publishing Google Docs
• How to attach documents and pdf's
• How to write a chemical process (see Processes Page)
  

Useful Links¶

• Wiki Markup for Screwturn Wiki
  

Orphaned Pages¶

• 1800 Series Photoresist Bottle Fill
• Anti-reflection coating (ARC)
• Billing Policy
• Chart Test
• Chart Test 2
• Chemical Hygiene Plan (CHP)
• Chemical Mechanical Polishing
• Chemical Storage Locations
• Cleaning
• CP4 Etch and Surface Barrier Application
• Chrome Etch for Masks
• CuInSe2
• Custom Plugins
• Double Stack Spin Rinse Dryer
• HF Etch
• L-Edit
• Metrology Wet Chem
• Mopping
• Preview Tab
• Resource Not Found
• Safety KOH (for Chem room only)
• SB-6E Bonder
• Security Cameras
• Silicon Etchant – Using Br (99.99%), HBr and DI-Water
• Small Photoresist Bottle Clean and Fill
• Standard Nanofabrication
• test
• Thin Film Metals Table
• WaferBOND CR-200 Temporary Bonding Application

Pages That Need to be Created¶

If you would like to contribute here is a list of pages that are referenced but do not exist yet. Click one to create a new page (log in required):

• A4-Boron-ANL-Oxide
• B2, TCA-Oxidation
• B3, Phos-dope
• B4 Phos ANL oxide
• Thermco B
• Dirty Piranha
• Glass tank, CMOS compatible (no metals)
• Wet Bench 3 -- Acid Bench- CMOS Clean
• Photoresist, (S1813)
• Photoresist, (SC 1827)
• 1800-series photoresist
• 950K PMMA A 4 (500ml)
• 950K PMMA A 6 (500ml)
• 950K PMMA A 9 (500ml)
• Tool Name SOP
• Electrode
• Magnetic Recording Media
• Microcoil
• Micromotor
• Microstructure
• Mirror
• Pressure Sensor
• Thermal Actuator
• Aqua Regia SOP
• dielectric
• refractive index
• Developer AZ 300
• Hydrogen Peroxide
• JTB-100
• 1450
• Annealing
• Chemical Mechanical Planarization (CMP)
• Dip Pen Lithography
• Electrical Testing
• Ellipsometry
• Gaseous Etching
• JEOL E-Beam
• Optical Microscopy
• Oxidation
• Plasma Clean
• Printing
• Profilometry
• Rapid Thermal Annealing
• Reactive Ion Etching RIE
• Reflectometry
• Scanning Electron Microscopy (SEM)
• Wafer Bonding
• Wet Clean
• Wire Bonding
• KMPR
• Photoresist-31
• bottle rinse stations
• Adhesion Promoters
• Catechol
• CR-2
• Developer, MF 726
• Ethanol, (200 proof)
• Ethylene Diamine
• Hydrochloric Acid (cmos)
• Nitric Acid (cmos)
• Photoresist, (SU-8 2010)
• Photoresist, (SU-8 5)
• Pyrazine
• Sulfuric Acid (cmos)
• Sylgard 184 Silicone elastomer kit
• TMAH 10% in Water (1 Liter)
• Trichloro(3,3,3-trifluoropropyl)silane(97%)
• A351
• Chlorobenzene
• HMDS coat
• Oxide etch
• Solvent clean
• Wafer Tongs
• Hard Contact
• Stepped Exposure
• ohmic contacts
• silicide
• InP
• Cr2O3
• nitride
• Wafer Mating
• 2,6-bis{(4-azidophenyl) methylene}-4-ehtylcyclohexanone
• AP3000
• B-staged divinylsiloxane-bis-benzocylcobutene
• Mesitylene
• Polymerized 1,2-dihydro-2,2,4-trimethylquinoline
• Safety Cyclotene Process
• STS Deep Silicon Etcher
• Solvent Bench 22
• Spinner Bench 21
• photoresists
• Safety E-beam Resist (PMMA) Development
• AZ 9260
• acetone
• hotplate
• Al- ½% Si
• Al -1% Si
• Al-2% Si
• Carbon
• WC
• 1480A
• Acid Bench
• Base Bench 23
• Convection Oven
• Copper Plating (Wet Chemistry)
• Dektak 6 M Surface Profilometer (Wet Chemistry)
• Dimatix InkJet
• Double Stack SRD
• EDP Bench
• EVG 520i Bonder
• EVG501s Bonder (DELETE THIS ONE ?)
• Indium Plating (Wet Chemistry)
• March Asher
• MJB 45S
• NanoInk DPN 5000
• Nickel Plating (Wet Chemistry)
• Olympus BX-51 Fluorescence Microscope
• Olympus LEXT Interferometer
• Permalloy Plating (Wet Chemistry)
• Solvent Bench
• Solvent Bench 03
• SUSS SB-6E Bonder
• HF
• KOH
• SF6
• TMAH
• Xenon Difluoride
• Fe
• Glasses
• Polypropylene
• seed layer
• Wafer Mounting
• Chemical Hygiene Plan (CHP
• Safety SOP Title Here
• AlGaAs
• Acid 02
• Acid 12
• Ga
• CategoryListFormatterHelp
• EventLogFormatterHelp
• FileListFormatterHelp
• LAM SOP
• Solvent
• AZ 300
• CEE 200X Spin Coater 1
• CEE 200X Spin Coater 2
• HMDS
• Mask Clean Bench
• RIE
• YES Vapor Prime Oven
• CEE 200X 1
• CEE 200X 2
• Scheduler
• 1440D
• 1440E
• 1440S
• 1448
• Chemical Benches
• Staff Pages
• Link Explanation 2
• MA BA-6
• Mask 13
• LEXT Olympus Laser Interferometer (Wet Chemistry)
• Metal Gate/ Gate Electrode
• Inversion Layer/ Channel
• Source/Drain
• Crystalbond 509
• Crystalbond 555
• Santovac 5
• metalization
• Silicon wafer thinning
• Source/drain
• SOP
• MSDS Pad Etch IV (Chemical solution)
• Co/Pd
• Safety Photoresist (PR) Coating (AZ 4000 and AZ 1800 Series)
• Amorphous Silicon
• Chemical bottle clean policy
• Solvent 03
• TEOS
• Electrochemical Discharge Machining
• Laser Machining
• Microdrill
• LPCVD
• ohmic contact
• Rapid thermal annealing oven (RTP/RTA)
• Safety SHIPLEY 1813 POSITIVE PHOTOLITHOGRAPHY PROCESS
• SiO2
• ZnS
• Ni/Ge/Au/Ti/Au
• Carbon nanotubes
• diffraction grating
• SU-8
• Ultrasonic liftoff
• Tools
• STS Glass Etcher Recipes
• LNF-logos
• LNF-Scheduler
• Lapping
• Mounting with Dicing Tape
• Mounting with PFPE
• Mounting with Photoresist